Intel is tired of hearing all day long that it is outdistanced by Samsung and TSMC. It must be admitted that regarding the manufacturing processes, a great vagueness remains and many have seized on it to make commercial arguments.
Because if we just compare the figures on the fineness of engraving, Intel seems to be years behind its direct competition (AMD) but also indirect like TSMC and Samsung. This observation is starting to pose a serious marketing problem for Intel.
The idea of renaming the manufacturing process begins to make its way at Intel.
The project would be to rename each manufacturing process made in Intel by finding a name that “sticks” to what the competition does. Don’t be too quick to jump to the conclusion that Intel is not necessarily wrong on the subject. For a long time now, there has been a controversy about the density in particular, but not only.
Take for example ASML, a Dutch company that is little known to the general public but that designs all the machines needed by foundries to achieve state-of-the-art manufacturing processes with EUV technology. Its vice president of technology development, Tony Ten, recently stated that Intel’s future 7nm would be equivalent to the Taiwanese and Korean company’ s 5nm.
But this is only part of Intel’s delay, since by the time it switches to this 7nm, TSMC will be on 4 or even 3nm.
Nevertheless, it is useless to attach an additional ball and chain to the foot and that Intel’s step seems to have understood it. If the new boss gives his agreement, we should be done with xynm +++, superfine + and other concepts more and more incomprehensible.
The post Intel may rename its manufacturing processes to keep up with the competition appeared first on HardwareHeaven.com.