MediaTek had recently announced the new Dimensity 9200+ SoC, which is its latest processor for high end smartphones. But it appears that the company is also planning to launch a new Dimensity 8300 chipset for mid range devices as well. Now, a new leak has revealed some of its key specifications. So here are all the details.
MediaTek Dimensity 8300 SoC to feature a 1+3+4 architecture
The leak arrives from tipster Revengus who shared the latest information on Twitter. Looking at this online post, the Dimensity 8300 will feature a 1+3+4 architecture. In other words, it will have a single Cortex X3 core that clocks in at 2.8GHz, along with 3x Cortex A714 core that operates at 2.4Ghz, and 4x Cortex A510 cores that has a clock speed of 1.6GHz. Furthermore, this chipset will be paired with an ARM Mali G52 MC6 GPU that runs at 850MHz.
The upcoming MediaTek Dimensity 8300 is believed to launch sometime later this year and will likely be positioned right below the upcoming Dimensity 9300, which is a flagship grade chipset. This processor might debut around November 2023, so we can expect the Dimensity 8300 might also be announced around this time.
Back in December 2022, the Chinese smartphone maker iQOO had announced the Neo 7 SE model with the Dimensity 8200 SoC. So, there is a possibility that the brand will ship its next gen models in the successor to the Neo 7 SE model. This is all the information we have at the moment, so stick around for more updates regarding this matter.
(Via)